Software-defined vehicles spur collaboration, disruption, and much more code; Lava Lamp entropy; AI for PHYs; fall detection; water risk.
A new technical paper titled “Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy” was published by researchers at ...
Fast, Low-Resistance Nano Gap Electromechanical Switch for Power Gating Applications” was published by researchers at KAIST and Chonnam National University. Abstract “The growing demand for artificial ...
A new technical paper titled “Effects of Proton Radiation on Tin Oxide: Implications for Space Electronics” was published by ...
Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
Driven On-Chip Integration for High Density and Low Cost” was published by researchers at University of Southern California.
Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.
Designers are utilizing an array of programmable or configurable ICs to keep pace with rapidly changing technology and AI.
In today’s fast-paced electronics design automation (EDA) environment, effective data management has become essential.
As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...
An agentic AI-based approach to end-to-end bug resolution using both error logs and waveforms.
Ensuring that verification platforms can scale with industry demands and support new use cases as they emerge.
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